09/20/2010, Irvine, California


Thermal Management Materials Get a Grip

While greases and phase change thermal interface materials (TIMs) have been established as the dominant products for thermal management of electronic devices, new demands for certain applications have given manufacturers cause to seek alternatives.

Driven by the requirements posed by device size and weight reductions, as well as the desire to migrate away from contaminating chemicals while also improving processability, electronics specialists are increasingly turning to thermally conductive adhesives as viable substitute for traditional thermal interface materials.

Spurred by consumer demand for smaller, high‐functioning devices, products such as mobile phones and higher powered LEDs have seen dramatic decreases in overall footprints in the last few years. But these are not the only applications that have witnessed such a shift, as miniaturization has taken hold in nearly all sectors of electronics including automotive. In fact, automotive electronics is one segment in particular where newer‐generation thermal interface materials are gaining momentum.

While auto electronics manufacturers have used thermally conductive adhesives in the past, many of these materials have come with drawbacks. These can include formulations that are silicone based, which presents contamination risk; requisite cure temperatures that are too high for certain devices; and little process adaptability.

Responding to the emerging needs of manufacturers in all electronics sectors – including automotive ‐‐ that require robust thermal management alternatives to traditional materials, Henkel R&D specialists have designed a brand new thermally conductive adhesive that marries the most desired characteristics with proven performance capability. The novel material, Hysol ECCOBOND TE3530, is a high performance dielectric adhesive designed for bonding heat dissipation components to electrical devices.

An epoxy‐based formulation, Hysol ECCOBOND TE3530, eliminates the contamination concern associated with silicone materials. The one component design also affords processing simplicity, as any mixing is eliminated and it can be applied via standard automatic dispensing equipment, helping to reduce costs by streamlining the process and making use of existing capital equipment.

Perhaps one of the most welcome attributes of Hysol ECCOBOND TE3530 is the latitude it extends for varying process conditions. The material cures at a remarkably low 100°C which enables manufacturers of temperature sensitive devices to enjoy its ease of use and robust performance without risk of damage to other components. If, on the other hand, a process dictates higher temperatures, Hysol ECCOBOND TE3530 can be cured at temperatures up to 150°C. Depending on the manufacturing methodologies employed, Hysol ECCOBOND TE3530 has the ability to be cured in‐line alongside other process heat cycles, which further enhances throughput. Plus, when using an adhesive in place of thermal greases or phase change materials, there is no requirement for clamps or screws to hold the device in place, which is yet another cost and time‐saving advantage of adhesives for thermal applications. Hysol ECCOBOND TE3550 delivers mechanical fixation, low thermal resistance and electrical isolation between the heat dissipating component and the corresponding mating surface.

All of these benefits are not at the sacrifice of exceptional thermal transfer capability, however, as Henkel’s newest adhesive innovation has a thermal conductivity of 2.3W/m.K, which is more than ample for many modern applications.

As electronics products become smaller with higher functioning components packed ever closer together within a smaller footprint, thermal management solutions must evolve to address the higher heat production of increasingly miniaturized technologies. Henkel’s Hysol ECCOBOND TE3530 does just that, delivering a one component, epoxybased, silicone‐free, low viscosity material with low cure temperature capability and thermal conductivity at 2.3W/m.K.


If you’re an electronics manufacturers that is struggling to find alternatives to greases, phase change materials and silicone‐based adhesives for today’s complex devices, Hysol ECCOBOND TE3530 can help you get a grip. Call us today at 714‐368‐8000 or log onto www.henkel.com/electronics for more information.