07/06/2009, Irvine, California
Innovative Formulation Provides High Reliability for High-Temp Applications
New Lead-Free Alloy that Takes Under-the-Hood Heat in Stride
While lead-free processes now seem like yesterday’s news and the electronics industry at large has generally accepted and commonly uses the SnAgCu (SAC) alloy, there are still market sectors that have struggled with prevailing SAC formulations. While the SAC alloy has proven to be a worthy lead-free material for the production of numerous devices, those applications that require high operating temperature performance and extremely high reliability have not had tremendous success with traditional SAC materials.