Macromelt® is a robust, environmentally friendly alternative to traditional potting and injection molding encapsulation techniques.  The simplicity of these materials is their advantage: because the entire Macromelt operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged. The polyamide hot melt material quickly encapsulates exposed circuitry to form the outer shell of the device, thus delivering a self-contained integrated assembly.  The process is fast, simple, cost-effective and perfect for delicate circuitry as the application pressure within the mold cavity is an incredibly low 20 to 500psi. PCB and circuitry protection is essential in modern, challenging applications; and Macromelt delivers manufacturers a proven, reliable solution.


• Automotive sensors • Battery sealing
• Hall effect sensors • Switches
• Circuit board protection  • Strain relief.