LOCTITE® ECCOBOND E 1216M
Features and Benefits
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M™ is a great pick. Our ECCOBOND E 1216M™ composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
- Void-free
- Retains stability during shipping, storage, and use
- Snap-curing
- High glass transition temperature (Tg)
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 131.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 35.0 ppm/°C |
| Glass transition temperature (Tg) | 125.0 °C |
| Viscosity, Brookfield, Spindle 4, speed 20 rpm | 4000.0 mPa·s (cP) |
| Work life | 5.0 day |
LOCTITE® ECCOBOND E 1216M
Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.