BERGQUIST® LIQUI BOND TLB EA1800
Known as Liqui-Bond® EA 1805
Features and Benefits
Silicone free, 2-part epoxy liquid for applications where mechanical and chemical stability is needed.
BERGQUIST® LIQUI BOND TLB EA1800 is a thermally-conductive epoxy liquid adhesive with excellent chemical and mechanical stability. The product cures at room temperature and creates a high bond strength, which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 1.8 W/m-K (ASTM D5470)
- High bond strength, room temperature cure
- Silicone-free
- Accelerated cure through heat
Documents and Downloads
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Technical Information
| Flame rating | V-0 |
| Operating temperature | -40.0 - 125.0 °C |
| Thermal conductivity | 1.8 W/mK |
| Resin | |
| Color, Resin | Gray |
| Hardener | |
| Color, Hardener | Light yellow |
BERGQUIST® LIQUI BOND TLB EA1800
Silicone free, 2-part epoxy liquid for applications where mechanical and chemical stability is needed.