Some BGA-type packages may alternatively use flip-chip ICs for interconnecting instead of wirebonds. In this case, the flip-chip mounted device dictates an assembly process change in which Wafer Bumping Solder Paste or Tacky Flux is used to attach the die instead of traditional die attach materials. Additionally, Underfills are used to protect the solder connections.

Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs) are laminate-based devices, which means they are essentially micro printed circuit boards (PCBs) on which ICs are mounted.