News 2017

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award 
Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.  more...
Abramovich Named Head of Sales Americas 
Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.  more...
Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications 
Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.  more...
Electrically Conductive Adhesive Provides Latitude for Automotive Electronics 
Henkel’s development of LOCTITE ABLESTIK ICP 3535M1 was a historic breakthrough for electrically conductive adhesives (ECAs), allowing use of the material with a more diverse component range. The material provides a robust alternative to solder for many applications, lowers component assembly stress and facilitates lead-free interconnection for regulatory compliance.  more...
New Henkel Materials Push beyond Conventional Limits, Improve Reliability and Performance 

At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.