News 2017

New masking technology and automotive reliability expertise earn Henkel recognition during Productronica 
During last month’s Productronica global electronics event in Munich, Germany, the electronics business of Henkel Adhesive Technologies took the top prize in its category for the Global Technology Awards contest, while Technical Service expert Richard Boyle was selected to share his know-how during a live video panel discussion about automotive reliability and testing. Together, these high-profile honors served to further illustrate Henkel’s electronic materials leadership position and the company’s effective total solutions approach.
Henkel Develops Conformal Coating Metal Inks, Enabling Semiconductor Package-Level EMI Shielding through Cost- Effective Direct Spraying Methods 
Henkel Adhesive Technologies’ Electronics business today announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic interference (EMI) shielding. LOCTITE ABLESTIK EMI 8660S and LOCTITE ABLESTIK EMI 8880S offer superior flexibility in deployment and design, as they may be used with cost-effective spray coating equipment, while providing EMI shielding performance comparable to or better than capital-intensive, thin film metal deposition techniques. With excellent adhesion to a variety of epoxy molding compounds, both materials enhance long-term reliability performance.  more...
Henkel eMove360° presence to highlight Automotive Electronic Solutions that enable bumper to bumper vehicle applications 
From Hall C3, Booth 301 at the eMove360° event in Munich, Henkel Adhesive Technologies’ Electronics business will display an extensive range of material technologies that are facilitating advances in automotive electronics innovation. The interactive exhibit takes visitors on a journey through Henkel materials integration into advanced driver assistance systems (ADAS), battery technologies for new energy vehicles (NEVs), automotive lighting and powertrain technologies, as well as chassis and interior systems.

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award 
Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.  more...
Abramovich Named Head of Sales Americas 
Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.  more...
Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications 
Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.  more...
Electrically Conductive Adhesive Provides Latitude for Automotive Electronics 
Henkel’s development of LOCTITE ABLESTIK ICP 3535M1 was a historic breakthrough for electrically conductive adhesives (ECAs), allowing use of the material with a more diverse component range. The material provides a robust alternative to solder for many applications, lowers component assembly stress and facilitates lead-free interconnection for regulatory compliance.  more...
New Henkel Materials Push beyond Conventional Limits, Improve Reliability and Performance 

At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.